Amkor Technology, founded in 1968, is one of the world’s largest providers of outsourced semiconductor packaging and testing services. Headquartered in Tempe, Arizona, Amkor is crucial in the electronics supply chain, offering advanced packaging solutions for integrated circuits (ICs) and microelectronics. Their services help deliver cutting-edge products across consumer electronics, automotive, communications, and computing industries. Amkor’s global footprint includes facilities in key regions like Asia, Europe, and the Americas, making it a trusted partner for some of the largest semiconductor manufacturers worldwide.
| Founded | 1968 |
| Founder | Hyang-Soo Kim |
| Headquarters | Tempe, Arizona, U.S. |
| Type | Public Traded as – [Nasdaq: AMKR] |
| Industry | Semiconductors & Related Devices |
| Website | amkor.com |
The History of Amkor Technology
Amkor Technology was founded in 1968 by James J. Kim as a small semiconductor packaging company in South Korea. Initially named Amkor Electronics, the company was created with a visionary business model: to provide outsourced semiconductor assembly and testing services. By allowing chip manufacturers to outsource their packaging and testing processes, Amkor allowed these companies to focus on chip design and innovation. This approach positioned Amkor at the forefront of the burgeoning semiconductor industry.
Early Growth and Partnerships
During the 1970s and 1980s, Amkor experienced rapid growth, fueled by the semiconductor boom and strategic partnerships with major electronics companies. Early collaborations with industry leaders like Intel and Texas Instruments proved instrumental in Amkor’s expansion. The company’s packaging solutions, which helped enhance chip performance and reduce size, met the growing demand for efficient and cost-effective semiconductor packaging.
Going Public and Global Expansion
In 1998, Amkor Technology took a significant step by going public and listing on the NASDAQ stock exchange. The IPO enabled Amkor to access broader capital markets and expand its manufacturing capabilities. The company established key facilities in regions such as China, Japan, Taiwan, and the Philippines, positioning itself as one of the largest outsourced semiconductor assembly and testing (OSAT) providers globally. This expansion allowed Amkor to serve a growing customer base across consumer electronics, automotive, telecommunications, and computing industries.
Innovation and Industry Leadership
Amkor’s commitment to research and development over the years led to innovations in semiconductor packaging. The company introduced advanced packaging technologies such as system-in-package (SiP) and Fan-Out Wafer Level Packaging (FOWLP). These innovations allowed for smaller, more efficient, and higher-performance chips, critical to the development of modern electronic devices.
Today, Amkor Technology remains a global leader in the semiconductor packaging and testing industry. It plays a vital role in the electronics supply chain and partners with some of the world’s largest technology companies.
