Samsung Electronics to Launch 3D HBM Chip Packaging Services in 2024
Key Points: Samsung is to launch 3D packaging services for HBM in 2024. The advanced technology is expected to debut in the sixth-generation HBM4 Expected in Nvidia’s Rubin GPU model in 2026. 3D packaging stacks HBM chips vertically, eliminating the need for a silicon interposer. Samsung Advanced Interconnection Technology-D for turnkey 3D HBM packaging. All-in-one heterogeneous integration technology by 2027. HBM is projected to make up 30% of the DRAM market in 2025, and the advanced packaging market will grow to $80 billion by 2032. Samsung Electronics Co. will introduce three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the...