Key Points: Samsung is to launch 3D packaging services for HBM in 2024. The advanced technology is expected to debut in the sixth-generation HBM4 Expected in Nvidia’s Rubin GPU model in 2026. 3D packaging stacks HBM chips vertically, eliminating the...
Key Points: Akio Toyoda faces opposition from ISS and Glass Lewis. Toyota apologized for fraudulent vehicle certification tests. Toyota's market value drops by 3 trillion yen ($18 billion). ISS and Glass Lewis criticize Toyoda for inadequate governance and internal controls. Concerns have been raised about Toyota's corporate culture under Toyoda. Major Japanese shareholders are likely...
