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Samsung Lands Major Chip Inquiries as TSMC Capacity Reaches Limits

Samsung Electronics
Samsung Electronics Powering Progress, Connecting the World. [TechGolly]

Key Points:

  • Global tech leaders like Google, AMD, Tesla, and BYD are turning to Samsung Foundry due to TSMC’s tight capacity.
  • Google is exploring a partnership with Samsung to manufacture components of its next-generation TPU “Icefish.”
  • Chinese EV giant BYD is in talks with Samsung for its advanced 4nm and 2nm autonomous driving chips.
  • The influx of orders is expected to return Samsung’s struggling foundry division to profitability by Q3 2026.

Samsung Lands Major contract chipmaking inquiries from some of the world’s most prominent technology and automotive giants, signaling a significant turning page in the global semiconductor landscape. Tech leaders, including Google, AMD, Tesla, and Chinese electric vehicle (EV) titan BYD, are increasingly turning to the South Korean conglomerate’s foundry division for advanced chip manufacturing. The sudden surge in business comes as the physical capacity of market leader Taiwan Semiconductor Manufacturing Company (TSMC) stretches to its absolute limits under the weight of the global artificial intelligence boom. By offering a highly viable, large-scale alternative for cutting-edge silicon fabrication, Samsung is poised to capture a substantial share of the high-end hardware market.

The severe, ongoing capacity crunch at TSMC’s advanced processing facilities primarily drives this massive industry shift. The Taiwanese giant currently manufactures the vast majority of the world’s high-performance AI processors and packaging solutions for mega-clients like Nvidia, Apple, Broadcom, and MediaTek. However, this immense backlog has left the company with virtually no spare advanced capacity in the near term. While TSMC has outlined multi-billion-dollar plans to expand its global fab network, building and ramping up cleanroom facilities is a highly capital-intensive and time-consuming process. This supply bottleneck has forced tech companies to adopt proactive dual-sourcing strategies to protect their product rollouts.

A primary example of this dual-sourcing strategy is Google’s highly anticipated 10th-generation Tensor Processing Unit (TPU), codenamed “Icefish,” which is targeted for mass production in 2028. While TSMC will reportedly manufacture the core computing unit of the chip using its advanced 1.4-nanometer line, Google is in advanced talks with Samsung to produce the critical input-output (I/O) die using its 2-nanometer process. This essential component connects the main processor to high-bandwidth memory (HBM) systems, directly dictating the speed at which the AI chip can receive and process data. Google is also discussing having Samsung manufacture its next-generation Axion server processors, which represents the first time the internet giant has moved hardware orders away from TSMC.

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Concurrently, Chinese electric vehicle pioneer BYD has initiated talks with the South Korean firm to supply the advanced chips needed to power its upcoming self-driving vehicle platforms. The proposed partnership involves the manufacturing of BYD’s proprietary Xuanji A3 series 4-nanometer and next-generation 2-nanometer gate-all-around (GAA) smart driving chips. As the world’s largest EV manufacturer moves aggressively to build out its autonomous driving software networks, securing a stable, high-volume hardware partner remains a top priority. Samsung’s ability to deliver advanced 4-nanometer and 2-nanometer processes makes it a highly attractive alternative to traditional automotive chip foundries.

The company is also negotiating with advanced processor designer AMD to manufacture some of its future central processing units (CPUs) starting in 2028. This potential partnership represents a major win, as AMD has traditionally relied heavily on TSMC for its high-performance computer and server processors. Additionally, Tesla has reportedly finalized a deal to produce its upcoming next-generation “AI6” self-driving chip at Samsung’s state-of-the-art foundry in Taylor, Texas, built under a massive $16.5 billion investment plan. These overlapping commitments prove that the world’s most innovative hardware companies no longer view the Korean firm merely as a secondary option, but as a critical strategic partner.

The sudden influx of big tech orders marks a spectacular operational turnaround for Samsung’s contract manufacturing division, which has endured financial losses over the past five consecutive quarters. Historically, the division struggled to win major, high-volume clients in the advanced sub-5-nanometer process segments due to persistent yield and production stability issues. However, by aggressively refining its gate-all-around transistor technology and improving yield rates across its 4-nanometer and 2-nanometer nodes, the company has successfully closed the quality gap with TSMC. Industry analysts expect these improvements to return the division to profitability as early as the third quarter of this year, ahead of previous internal targets.

Beyond raw capacity limits, changing geopolitical dynamics are also driving global tech companies to diversify their manufacturing partners. With over 90% of the world’s most advanced chips manufactured in Taiwan, both American and Chinese technology giants are highly vulnerable to localized regional disruptions, trade restrictions, and supply chain blockades. By spreading their advanced-node orders across both Taiwan and South Korea, and utilizing Samsung’s expanding manufacturing footprint in Texas, multinational firms can successfully hedge their geopolitical risks, ensuring that their AI and hardware pipelines remain fully operational even during times of international tension.

The massive wave of contract inquiries and new orders points to a permanent realignment of the global semiconductor supply chain. The comfortable era when a single dominant foundry could easily manage the entire world’s advanced computing needs has officially ended, shattered by the insatiable demands of the artificial intelligence boom. By successfully turning its combined strengths in high-bandwidth memory, advanced packaging, and 2-nanometer logic manufacturing into a major competitive advantage, Samsung has cemented its position as a primary architect of the digital age. As the first shipments under these new agreements prepare to roll out, this dual-sourcing model will likely establish a more resilient, balanced, and secure future for global technology.

EDITORIAL TEAM
EDITORIAL TEAM
Al Mahmud Al Mamun leads the TechGolly editorial team. He served as Editor-in-Chief of a world-leading professional research Magazine. Rasel Hossain is supporting as Managing Editor. Our team is intercorporate with technologists, researchers, and technology writers. We have substantial expertise in Information Technology (IT), Artificial Intelligence (AI), and Embedded Technology.